Future HTC smartphones could be thinner, more lightweight and paradoxically stronger, if rumors about the company’s manufacturing processes are true. The company has turned to Chenming Mold Industrial (CMI) and Nano Molding Technology (NMT), DigiTimes reports, for a new smartphone; NMT is a system of injecting plastic components directly onto a metal shell, reducing overlap thickness in the process.
The back panel on HTC’s Sensation – pictured above – shows the current
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